DocumentCode :
181576
Title :
A new occupancy grid of the dynamic environment for autonomous vehicles
Author :
Yu Xin ; Huawei Liang ; Tao Mei ; Rulin Huang ; Mingbo Du ; Chen Sun ; Zhiling Wang ; Ruhai Jiang
Author_Institution :
Dept. of Autom., Univ. of Sci. & Technol. of China, Hefei, China
fYear :
2014
fDate :
8-11 June 2014
Firstpage :
787
Lastpage :
792
Abstract :
As an effective environment representation method, the obstacle occupancy grid has been widely applied on the autonomous vehicle, providing evidence for the behavior decision and path planning of autonomous vehicle. In this paper, a new obstacle occupancy grid named space-time occupancy grid map is presented. This map pays more attention on the dynamic obstacles in a period of future time, and maps the obstacle occupancy information in space-time dimension to two-dimensional grid. In this way, the useful obstacle occupancy information for the autonomous vehicle in a period of future time is provided, which enables the behavior decision and path planning to be more intelligent. The space-time occupancy grid map described in this paper has been applied on the two generations of autonomous vehicles, “Intelligent Pioneer I” and “Intelligent Pioneer II”, which have already completed 10,000 kilometers actual road tests in western suburb of Hefei, and won the first prize in the “Intelligent Vehicle Future Challenge of China” Competition funded by Natural Science Foundation of China.
Keywords :
collision avoidance; intelligent robots; mobile robots; 2D grid; Intelligent Pioneer I; Intelligent Pioneer II; Intelligent Vehicle Future Challenge of China; Natural Science Foundation of China; autonomous vehicle; behavior decision; dynamic environment; dynamic obstacle; environment representation method; obstacle occupancy grid; path planning; space-time dimension; space-time occupancy grid map; Dynamics; Green products; Laser radar; Mobile robots; Path planning; Roads; Vehicle dynamics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Intelligent Vehicles Symposium Proceedings, 2014 IEEE
Conference_Location :
Dearborn, MI
Type :
conf
DOI :
10.1109/IVS.2014.6856407
Filename :
6856407
Link To Document :
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