Thermal conductivity of boron nitride filled epoxy resins: temperature dependence and influence of sample preparation

Author

Bujard, P.

Author_Institution

Ciba-Geigy Ltd., Fribourg, Switzerland

fYear

1988

fDate

11-13 May 1988

Firstpage

41

Lastpage

49

Abstract

Castable particulate-filled epoxy resins exhibiting excellent thermal conductivity have been prepared using hexagonal boron nitride (BN) as filter. The thermal conductivity of BN filled epoxies is influenced by the sample preparation procedures, due to agglomeration effects of the particles in the matrix. The temperature dependence of the thermal conductivity of resins is measured as a function of the volume content of filler. The thermal conductivity in percolative systems depends in a complex way on the filler concentration and on the temperature. The mechanisms leading to the observed behavior are discussed

Keywords

boron compounds; filled polymers; materials preparation; packaging; thermal conductivity of solids; BN filled epoxy resins; agglomeration effects; castable resins; filler concentration; hexagonal BN filter; matrix particles; packaging material; particle reinforced composite; percolative systems; polymers; sample preparation; temperature dependence; thermal conductivity; Atmospheric modeling; Boron; Conductivity measurement; Dielectrics and electrical insulation; Epoxy resins; Particle scattering; Temperature dependence; Thermal conductivity; Thermal expansion; Thermal loading;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-THERM '88, InterSociety Conference on

Conference_Location

Los Angeles, CA

Type

conf

DOI

10.1109/ITHERM.1988.28676

Filename

28676