Temperature distribution in IC plastic packages in the reflow soldering process

Author

Miura, Hideo ; Nishimura, Asao ; Kawai, Sueo ; Nakayama, Wataru

Author_Institution

Hitachi Ltd., Ibaraki, Japan

fYear

1988

fDate

11-13 May 1988

Firstpage

50

Lastpage

59

Abstract

Temperature distribution in the packages is evaluated by both experimental method and an analytical finite-element method (FEM). It is found that the FEM analysis is useful for the temperature estimation of the packages. Temperature sensors imbedded in silicon chips were used to measure the temperature distribution in the package in both the reflow soldering process and the dip-coating process. These sensor chips were encapsulated in the actual DIP (dual in-line package) type package and SOJ (small outline j-bend package) type package. Temperature distributions of these packages were measured under various soldering conditions

Keywords

finite element analysis; integrated circuit technology; packaging; plastics; soldering; temperature distribution; DIP; FEM; IC plastic packages; SOJ; dip-coating process; dual in-line package; encapsulated sensor chips; finite-element method; imbedded temperature sensors; reflow soldering process; small outline j-bend package; temperature distribution; Dip coating; Electronics packaging; Finite element methods; Plastic integrated circuit packaging; Reflow soldering; Semiconductor device measurement; Silicon; Temperature distribution; Temperature measurement; Temperature sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-THERM '88, InterSociety Conference on

Conference_Location

Los Angeles, CA

Type

conf

DOI

10.1109/ITHERM.1988.28677

Filename

28677