• DocumentCode
    1815842
  • Title

    Metallized and oxidized silicon macropore arrays filled with a scintillator for CCD-based x-ray imaging detectors

  • Author

    Badel, X. ; Linnros, J. ; Kleimann, P. ; Norlin, B. ; Koskiahde, E. ; Valpas, K. ; Nenonen, S. ; Petersson, S. ; Fröjdh, C.

  • Author_Institution
    Dept. of Microelectron. & Inf. Technol., R. Inst. of Technol. of Sweden, Kista, Sweden
  • Volume
    2
  • fYear
    2003
  • fDate
    19-25 Oct. 2003
  • Firstpage
    1006
  • Abstract
    Silicon Charge Coupled Devices (CCD) covered with a scintillating film are now available on the market for use in digital medical imaging. However, these devices could still be improved in terms of sensitivity and especially spatial resolution by coating the CCD with an array of scintillating waveguides. In this work, we fabricated such waveguides by first etching pores in silicon, then pet-forming metallization or oxidation of the pore walls and finally filling the pores with CsI(Tl). The resulting structures were observed using SEM and tested under X-ray exposure. The detector performances were also compared with simulations, indicating that the optimal pore depth for metallized macropore arrays is about 80μm while it is around 350μm for oxidized ones. This result, together with the roughness of the metal coating, explains why lower performances were measured experimentally with the metallized macropores. Indeed, our macropore arrays had depths in the range of 210-390μm, which is favorable to oxidized structures.
  • Keywords
    CCD image sensors; silicon radiation detectors; solid scintillation detectors; CCD-based x-ray imaging detectors; Si; metallized Si macropore arrays; oxidized Si macropore arrays; scintillating waveguides; scintillator; Charge coupled devices; Charge-coupled image sensors; Coatings; Metallization; Semiconductor films; Sensor arrays; Silicon; X-ray detection; X-ray detectors; X-ray imaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nuclear Science Symposium Conference Record, 2003 IEEE
  • ISSN
    1082-3654
  • Print_ISBN
    0-7803-8257-9
  • Type

    conf

  • DOI
    10.1109/NSSMIC.2003.1351864
  • Filename
    1351864