Thermal analysis of a two-dimensional electronic board

Author

Yao, S.C. ; Su, K.E.

Author_Institution

Dept. of Mech. Eng., Carnegie-Mellon Univ., Pittsburgh, PA, USA

fYear

1988

fDate

11-13 May 1988

Firstpage

79

Lastpage

84

Abstract

A computer program has been established to evaluate the thermal performance of two-dimensional electronic boards with elements of unequal heights. Details of convective, conductive, and radiative heat transfer are considered. Experiments have been performed in a wind tunnel on a board of 70 elements arranged in 7 columns. Thermal infrared pictures at various flow conditions are taken. The computed results agree well with the experimental data. Some critical but unresolved questions regarding the heat transfer on the pins and at the back side of the board are also discussed

Keywords

electronic engineering computing; modelling; printed circuits; thermal analysis; computer program; conductive heat transfer; convective heat transfer; flow conditions; radiative heat transfer; thermal IR pictures; thermal performance; two-dimensional electronic board; wind tunnel; Computer network management; Heat transfer; Industrial electronics; Mechanical engineering; Packaging; Pins; Surface resistance; Temperature; Thermal management of electronics; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-THERM '88, InterSociety Conference on

Conference_Location

Los Angeles, CA

Type

conf

DOI

10.1109/ITHERM.1988.28681

Filename

28681