Title :
Forced convection heat transfer of a vertical shrouded fin array
Author :
Chyu, M.K. ; Wu, L.X. ; Murthy, J.Y.
Author_Institution :
Dept. of Mech. Eng., Carnegie-Mellon Univ., Pittsburgh, PA, USA
Abstract :
Summary form only given. The detailed local distribution is obtained of the convective heat transfer coefficient on the fin structure. A mass transfer system using the naphthalene sublimation technique is chosen for the study. The test model is fabricated by coating a layer of naphthalene on the fin surface; this gives the surface an equivalence to the isothermal boundary condition in heat transfer. This also implies that the fin array has 100% of fin efficiency. A state-of-the-art, computer-automated measurement system is used to acquire the naphthalene surface profiles before and after the surface exposure to the air stream in a wind tunnel. The present test uses fixed values of fin height-to-space ratio (approximately 1.5) and the streamwise dimension (approximately 5 fin heights)
Keywords :
convection; cooling; heat sinks; packaging; air stream; convective heat transfer coefficient; fin structure; forced convection; heat sinks; isothermal boundary condition; local distribution; mass transfer system; naphthalene sublimation technique; naphthalene surface profiles; packaging; vertical shrouded fin array; wind tunnel; Coolants; Electronic packaging thermal management; Electronics cooling; Heat sinks; Heat transfer; Microelectronics; Plastic packaging; Surface resistance; Testing; Thermal resistance;
Conference_Titel :
Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-THERM '88, InterSociety Conference on
Conference_Location :
Los Angeles, CA
DOI :
10.1109/ITHERM.1988.28683