Fluid selection and property effects in single and two-phase immersion cooling [electronic components]

Author

Lee, Y. ; Saylor, J. ; Simon, T. ; Tong, W. ; Wu, P.S. ; Bar-Cohen, A.

Author_Institution

Dept. of Mech. Eng., Minnesota Univ., Minneapolis, MN, USA

fYear

1988

fDate

11-13 May 1988

Firstpage

92

Lastpage

99

Abstract

The governing equations for liquid and two-phase heat transfer are used to derive fluid figures-of-merit (FOMs) for liquid-forced and natural convection, boiling incipience, and critical heat flux in both pool and flow boiling modes. These FOMs are given to help evaluate and compare the thermal performance of several candidate immersion cooling fluids. In addition, the governing equations are used to determine the sensitivities of thermal performance to fluid property values

Keywords

boiling; convection; cooling; packaging; boiling incipience; critical heat flux; electronic components; flow boiling modes; fluid figures-of-merit; fluid selection; liquid-forced convection; natural convection; nucleate boiling; pool boiling mode; property effects; single phase immersion cooling; thermal performance; two-phase heat transfer; two-phase immersion cooling; Coolants; Design engineering; Dielectric liquids; Electronic components; Electronics cooling; Equations; Fluid flow control; Heat transfer; Immersion cooling; Mechanical engineering;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-THERM '88, InterSociety Conference on

Conference_Location

Los Angeles, CA

Type

conf

DOI

10.1109/ITHERM.1988.28685

Filename

28685