DocumentCode :
1816228
Title :
A robust physical and predictive model for deep-submicrometer MOS circuit simulation
Author :
Huang, J.H. ; Liu, Z.H. ; Jeng, M.C. ; Ko, P.K. ; Hu, C.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
fYear :
1993
fDate :
9-12 May 1993
Abstract :
An efficient physical and predictive model (the Berkeley short-channel insulated-gate FET model, or BSIM3) for deep-submicrometer MOSFETs is presented with emphasis on both digital and analog applications. BSIM3 has extensive built-in dependences of important dimensional and processing parameters such as channel length, width, gate oxide thickness, junction depth, substrate doping concentration, and LDD (lightly doped drain) structures. The model is compact, and time-consuming functions are excluded. The ease of parameter extraction was a major consideration. The number of parameters is small (~25), and every parameter has a physical meaning; the effects of parameters on output characteristics are very predictive. This feature of BSIM3 makes statistical study of the device fabrication process possible. BSIM3 has been implemented in SPICE3 and the divergence problem is also greatly improved
Keywords :
integrated circuit modelling; BSIM3; Berkeley short-channel insulated-gate FET model; LDD; SPICE3; analogue circuits; channel length; channel width; deep-submicrometer MOS circuit simulation; device fabrication process; digital circuits; divergence problem; gate oxide thickness; junction depth; output characteristics; parameter extraction; predictive model; robust physical model; substrate doping concentration; Application software; Circuit simulation; Doping; MOSFETs; Parameter extraction; Poisson equations; Predictive models; Robustness; Semiconductor process modeling; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Custom Integrated Circuits Conference, 1993., Proceedings of the IEEE 1993
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0826-3
Type :
conf
DOI :
10.1109/CICC.1993.590711
Filename :
590711
Link To Document :
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