Test of a 622 MHz hybrid module for ATM network using a 200 MHz validation station

DFT (design for testability) methods which improve the efficiency of both wafer test and hybrid module test at the service operating frequency of 622 MHz are presented. A low-cost hardware environment has been adapted to the available IMS ATS 200 validation station which operates up to 200 MHz. The global test cost of the hybrid module is decreased by eliminating the defective dice. Characterizations and measures of the chips on wafer have been correlated with those done after packaging in standard package. The link between the frequency/temperature performance in package and frequency performance on wafer at room temperature shows the correctness of this test approach