Computer aided design and packaging optoelectronic systems with free space optical interconnects

Author

Lee, Sing H. ; Ozguz, V.H. ; Fan, J. ; Zaleta, D. ; Cheng, C.K.

Author_Institution

Dept. of Electr. & Comput. Eng., California Univ., at San Diego, La Jolla, CA, USA

fYear

1993

fDate

9-12 May 1993

Abstract

An introduction to current research in computer-aided design (CAD) and packaging for optoelectronic systems utilizing free space optical interconnects is presented. New CAD tools are presented that allow layout of multistage networks based on CGH fabrication limitations and the subsequent synthesis of the interconnect holograms. Recent work involving double-sided alignment of a single substrate as well as alignment techniques between two different substrates is discussed. Several packaged systems utilizing photorefractive crystals to minimize alignment problems are also presented

Keywords

optical interconnections; CGH fabrication limitations; computer-aided design; double-sided alignment; free space optical interconnects; interconnect holograms; layout; multistage networks; optoelectronic MCM; optoelectronic systems; packaging; photorefractive crystals; reconfigurable system; synthesis tools; Electronic packaging thermal management; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Optical arrays; Optical computing; Optical design; Optical interconnections; Optical modulation; Optical refraction;

fLanguage

English

Publisher

ieee

Conference_Titel

Custom Integrated Circuits Conference, 1993., Proceedings of the IEEE 1993

Conference_Location

San Diego, CA

Print_ISBN

0-7803-0826-3

Type

conf

DOI

10.1109/CICC.1993.590818

Filename

590818