Title :
Computer aided design and packaging optoelectronic systems with free space optical interconnects
Author :
Lee, Sing H. ; Ozguz, V.H. ; Fan, J. ; Zaleta, D. ; Cheng, C.K.
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., at San Diego, La Jolla, CA, USA
Abstract :
An introduction to current research in computer-aided design (CAD) and packaging for optoelectronic systems utilizing free space optical interconnects is presented. New CAD tools are presented that allow layout of multistage networks based on CGH fabrication limitations and the subsequent synthesis of the interconnect holograms. Recent work involving double-sided alignment of a single substrate as well as alignment techniques between two different substrates is discussed. Several packaged systems utilizing photorefractive crystals to minimize alignment problems are also presented
Keywords :
optical interconnections; CGH fabrication limitations; computer-aided design; double-sided alignment; free space optical interconnects; interconnect holograms; layout; multistage networks; optoelectronic MCM; optoelectronic systems; packaging; photorefractive crystals; reconfigurable system; synthesis tools; Electronic packaging thermal management; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Optical arrays; Optical computing; Optical design; Optical interconnections; Optical modulation; Optical refraction;
Conference_Titel :
Custom Integrated Circuits Conference, 1993., Proceedings of the IEEE 1993
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0826-3
DOI :
10.1109/CICC.1993.590818
