Title :
Optical properties of self-assembled silica particles
Author :
Tatara, Y. ; Sat, H. ; Nishikawa, H.
Author_Institution :
Dept. of Electr. Eng., Shibaura Inst. of Technol., Tokyo, Japan
Abstract :
We investigated optical properties of mono-dispersed silica with diameters of several hundred nanometers. The mono-dispersed silica particles were formed by the Stober method from tetraethoxysilane (TEOS). Structures and impurities of the silica particles were studied by Fourier Transform Infrared (FT-IR) absorption. Impurities such as hydroxyls were removed by an anneal at temperatures more than 500 C. In addition, the peak position around 1100 cm-1 due to the Si-O bonds was changed to higher frequencies during the anneal. This suggests the structures such as Si-O-Si bond angles of mono-dispersed silica were modified during annealing. These silica particles were easily self-assembled on silicon substrates or glass. The states of the self-assembled structures were observed by an optical microscope, an atomic force microscope, and a scanning electron microscope. Two dimensional or three dimensional close-packed structures with were observed.
Keywords :
Fourier transform spectra; annealing; atomic force microscopy; bond angles; disperse systems; infrared spectra; monolayers; nanoparticles; optical microscopy; scanning electron microscopy; self-assembly; silicon compounds; 1100 cm-1; 500 C; FTIR spectra; Fourier transform infrared absorption; Si; Si-O bonds; Si-O-Si bond angles; SiO2; Stober method; annealing; atomic force microscopy; glass substrates; hydroxyls; mono-dispersed silica; optical microscopy; optical properties; scanning electron microscopy; self-assembled silica particles; silicon substrate; three dimensional close-packed structures; two dimensional close-packed structures; Annealing; Atom optics; Atomic force microscopy; Electromagnetic wave absorption; Fourier transforms; Impurities; Optical microscopy; Scanning electron microscopy; Self-assembly; Silicon compounds;
Conference_Titel :
Properties and Applications of Dielectric Materials, 2003. Proceedings of the 7th International Conference on
Print_ISBN :
0-7803-7725-7
DOI :
10.1109/ICPADM.2003.1218348
