DocumentCode :
1818081
Title :
Study on DHP temperature effect in PSPI exposure process
Author :
Kim, Doyoung ; Song, Kyungsoo ; Kim, Chankyung ; Lee, Sieung
Author_Institution :
Sch. of Semicond. Eng., Samsung Inst. of Technol., Yongin
Volume :
1
fYear :
2008
fDate :
13-15 Oct. 2008
Firstpage :
151
Lastpage :
154
Abstract :
PSPI has been applied to the end-fab process for better efficiency. However, it causes process time to increase, which can be a serious problem in the photo process. Excessive exposure time results in lower efficiency and lower productivity as well. It is also blamed for a damage of expensive equipment lens. Existing countermeasures have yet to clear those problems. As an alternative, DHP temperature control is expected to reduce exposure time by adjusting the hardness of PSPI. Consequently, exposure time per shot can be sharply reduced, enhancing productivity of photo process where many shots are repeatedly exposed to a wafer.
Keywords :
dissociation; optical polymers; semiconductor technology; PSPI; dehydration hot plate; end-fab process; exposure time; hardness; photosensitive polyimide; temperature effect; Chip scale packaging; Circuits; Coatings; DH-HEMTs; Lenses; Polyimides; Productivity; Semiconductor materials; Temperature control; Temperature distribution; DHP(dehydration hot plate); PSPI(photo sensitive polyimide); exposure time;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Conference, 2008. CAS 2008. International
Conference_Location :
Sinaia
ISSN :
1545-827X
Print_ISBN :
978-1-4244-2004-9
Type :
conf
DOI :
10.1109/SMICND.2008.4703354
Filename :
4703354
Link To Document :
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