Packaged single pole double thru (SPDT) and true time delay lines (TTDL) based on RF MEMS switches

Author

De Angelis, Giorgio ; Lucibello, Andrea ; Marcelli, Romolo ; Catoni, Simone ; Lanciano, Antonio ; Buttiglione, Roberta ; Dispenza, Massimiliano ; Giacomozzi, Flavio ; Margesin, Benno ; Maglione, Alfredo ; Erspan, Mirko ; Combi, Chantal

Author_Institution

CNR-IMM Roma, Rome

Volume

1

fYear

2008

fDate

13-15 Oct. 2008

Firstpage

227

Lastpage

230

Abstract

Packaged MEMS devices for RF applications have been modelled, realized and tested. In particular, RF MEMS single ohmic series switches (SPST) have been obtained on silicon high resistivity substrates and they have been integrated in alumina packages to get single-pole-double-thru (SPDT) and true-time-delay-line (TTDL) configurations. As a result, TTDLs for wide band operation, designed for the (6-18) GHz band, have been obtained, with predicted insertion losses less than 2 dB up to 14 GHz for the short path and 3 dB for the long path, and delay times in the order of 0.3-0.4 ns for the short path and 0.5-0.6 ns for the long path. The maximum differential delay time is in the order of 0.2 ns.

Keywords

delays; electronics packaging; microswitches; microwave switches; RF MEMS single ohmic series switches; alumina packages; frequency 6 GHz to 18 GHz; insertion losses; packaged single pole double thru; silicon high resistivity substrates; time 0.2 ns; time 0.3 ns to 0.4 ns; time 0.5 ns to 0.6 ns; true time delay lines; Conductivity; Delay effects; Microelectromechanical devices; Packaging; Radio frequency; Radiofrequency microelectromechanical systems; Silicon; Switches; Testing; Wideband; RF MEMS; SPDT; SPST; TTDL; packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Conference, 2008. CAS 2008. International

Conference_Location

Sinaia

ISSN

1545-827X

Print_ISBN

978-1-4244-2004-9

Type

conf

DOI

10.1109/SMICND.2008.4703376

Filename

4703376