Design of AC-coupled circuit for high-speed interconnects

Author

Chun-Wei Huang ; Kai-Jen Liu ; Yu-Jung Huang ; Ming-Kun Chen ; Yi-Lung Lin ; Ming-Dou Ker

Author_Institution

Dept. of Electron. Eng., I-Shou Univ., Kaohsiung, Taiwan

fYear

2012

fDate

18-20 Nov. 2012

Firstpage

87

Lastpage

90

Abstract

The scaling of semiconductor technology together with 3D IC stacking integration make it possible for many portable electronics to process large amount of multimedia data. AC-coupling enables chip placed face-to-face for signal transmission using close-field capacitive coupling. A high performance system design using AC coupled interconnect (ACCI) technology not only achieves shorter and faster interconnection between dies but also increases packaging density. This paper describes a chip-to-chip circuit design suitable for high-speed 3DIC interconnected applications. The AC-Coupled face-to-face (F2F) chip was simulated using HSPICE with TSMC 0.18-μm 1P6M CMOS technology process file under a 1.8 V supply voltage. The simulation results indicated the proposed circuit with the self-test characteristics can achieve differential signal transmission up to 2.5 Gbps.

Keywords

CMOS integrated circuits; automatic testing; coupled circuits; design for testability; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; three-dimensional integrated circuits; 3D IC stacking integration; AC coupled interconnection technology; AC-coupled face-to-face circuit design; ACCI; F2F; HSPICE simulation; TSMC 1P6M CMOS technology; chip-to-chip circuit design; close-field capacitive coupling; high-speed 3D IC interconnection application; high-speed interconnection; multimedia data; packaging density; portable electronics; self-test characteristics; semiconductor scaling technology; signal transmission; size 0.18 mum; voltage 1.8 V; AC-Coupled; differential signal transmission; high-speed interconnected; three-dimensional integrated circuit (3D IC);

fLanguage

English

Publisher

ieee

Conference_Titel

Global High Tech Congress on Electronics (GHTCE), 2012 IEEE

Conference_Location

Shenzhen

Print_ISBN

978-1-4673-5086-0

Type

conf

DOI

10.1109/GHTCE.2012.6490130

Filename

6490130