Title :
High speed communications links for ASICs
Author :
Burrows, D. ; Hunt, Kevin
Abstract :
Summary form only given. ASIC integration and speeds have risen rapidly in the past couple of years to the point now where 50 to I00 MHz clock rates and hundreds of thousands of used gates are commonplace. These performance and integration levels place huge demands on chip-to-chip data transfer and packaging, with communications rates of up to 1 Gbit/sec being required. The author compares some of the traditional I/O standards available to an ASIC designer such as TTL, CMOS with some of the more recent advances such as PECL, GTL, and LVDS. Design considerations and limitations of these modern schemes are explored
Keywords :
application specific integrated circuits; clocks; integrated circuit design; integrated circuit packaging; logic arrays; ASIC design; I/O standards; chip-to-chip data transfer; clock rates; integration levels; logic circuits; packaging; Application specific integrated circuits; CMOS process; Cables; Clocks; Frequency measurement; Large scale integration; Logic; Packaging; Semiconductor device modeling; Silicon;
Conference_Titel :
European Design and Test Conference, 1995. ED&TC 1995, Proceedings.
Conference_Location :
Paris
Print_ISBN :
0-8186-7039-8
DOI :
10.1109/EDTC.1995.470340