Pixel multichip module design for a high energy physics experiment

Author

Cardoso, G. ; Andresen, J. ; Appel, J.A. ; Chiodini, G. ; Christian, D.C. ; Hall, B.K. ; Kwan, S.W. ; Turqueti, M.A. ; Zimmermann, S.

Author_Institution

Fermi Nat. Accel. Lab., USA

Volume

1

fYear

2003

fDate

19-25 Oct. 2003

Firstpage

68

Abstract

At Fermilab, a pixel detector multichip module is being developed for the BTeV experiment. The module is composed of three layers. The lowest layer is formed by the readout integrated circuits (ICs). The back of the ICs is in thermal contact with the supporting structure, while the top is flip-chip bump-bonded to the pixel sensor. A low mass flex-circuit interconnect is glued on the top of this assembly, and the readout IC pads are wire-bounded to the circuit. This paper presents recent results on the development of a multichip module prototype and summarizes its performance characteristics.

Keywords

flip-chip devices; nuclear electronics; BTeV experiment; Fermilab; flip-chip bump-bonded; high energy physics experiment; low mass flex-circuit interconnect; multichip module prototype; pixel multichip module design; readout IC pads; readout integrated circuits; thermal contact; Assembly; Detectors; Integrated circuit interconnections; Laboratories; Magnetic fields; Multichip modules; Particle beams; Sensor arrays; Sensor phenomena and characterization; Thermal sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Nuclear Science Symposium Conference Record, 2003 IEEE

ISSN

1082-3654

Print_ISBN

0-7803-8257-9

Type

conf

DOI

10.1109/NSSMIC.2003.1352000

Filename

1352000