Development of flip-chip bonding technology for (Cd,Zn)Te

Author

Fiederle, Michael ; Braml, Heiko ; Fauler, Alex ; Giersch, Jürgen ; Ludwig, Jens ; Anton, Gisela ; Jakobs, Karl

Author_Institution

Albert-Ludwigs-Univ., Freiburg, Germany

Volume

1

fYear

2003

fDate

19-25 Oct. 2003

Firstpage

232

Abstract

We developed a Flip-Chip-Bonding Technology for CdTe and (Cd,Zn)Te. The intention of this work was to choose a suitable chip interconnection technique for the fabrication of X-ray pixel-detectors to fit the material requirements of detector grade CdTe or (Cd,Zn)Te material. The proposed method based on a flexible core process, which permits the use of eutectic PbSn solder alloy or In solder. In particular PbSn solder bumping is attained by an electroplating process through a photo resist mask. A photosensitive polymer acts as passivation layer and solder stop mask on CdTe or (Cd,Zn)Te. The proposed process provides the opportunity to do all process steps "in-house".

Keywords

II-VI semiconductors; cadmium compounds; flip-chip devices; lead alloys; passivation; semiconductor counters; soldering; tin alloys; zinc compounds; (Cd,Zn)Te; CdZnTe; In solder; X-ray pixel-detectors; chip interconnection technique; eutectic PbSn solder alloy; flip-chip bonding technology; Bonding processes; Collaboration; Detectors; Fabrication; Gold; Passivation; Polymers; Resists; Semiconductor materials; Stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Nuclear Science Symposium Conference Record, 2003 IEEE

ISSN

1082-3654

Print_ISBN

0-7803-8257-9

Type

conf

DOI

10.1109/NSSMIC.2003.1352037

Filename

1352037