600V, 450A IGBT power module for 50kw electrical vehicle

Author

Chun-Kai Liu ; Yu-Lin Chao ; June-Chien Chang ; Wei Li ; Chih-Ming Tzeng ; Rong-Chang Fang ; Kuo-Shu Kao ; Tao-Chih Chang ; Chang-Sheng Chen ; Ming-Kan Liang ; Wei-Chung Lo

Author_Institution

Electron. & Opto-Electron. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan

fYear

2013

fDate

8-11 July 2013

Firstpage

1

Lastpage

5

Abstract

Insulated gate bipolar transistor (IGBT) power modules are widely used in household, industry and vehicle applications due to the features of higher efficiency, smaller size, low cost and higher reliability. However, the large power dissipation of IGBT and diode chips and harsh application environment of vehicle, reliability is an important issue. In this paper, the 600V, 450A IGBT power module packaging technologies for 50kW electrical vehicle (EV) are developed and verified. The integrated electrical, thermal, and stress design is established. Module assembly technologies include chip on direct bond copper (DBC) substrate bonding, DBC substrate on base plate bonding, heavy Al wire bonding are developed. Finally, the performance of power module is verified by module testing, system platform testing and EV vehicle testing. The results show that the IGBT power modules have good performance and successfully pass through the system platform and EV vehicle tests.

Keywords

automotive electronics; electric vehicles; insulated gate bipolar transistors; lead bonding; DBC substrate bonding; EV vehicle testing; IGBT power module packaging technology; base plate bonding; chip-on-direct bond copper; current 450 A; diode chips; electrical vehicle; heavy-aluminium wire bonding; insulated gate bipolar transistor power module; integrated electrical-thermal-stress design; module assembly technology; module testing; power 50 kW; power dissipation; power module performance; reliability; system platform testing; voltage 600 V; Bonding; Insulated gate bipolar transistors; Multichip modules; Reliability; Resistance; Vehicles; Wires; IGBT power module; direct bond copper; electric vehicle; thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Electronics for Distributed Generation Systems (PEDG), 2013 4th IEEE International Symposium on

Conference_Location

Rogers, AR

Type

conf

DOI

10.1109/PEDG.2013.6785626

Filename

6785626