DocumentCode
1821098
Title
3D specific systems design and CAD
Author
Franzon, Paul D. ; Davis, W. Rhett ; Thorolfsson, Thor ; Melamed, Samson
Author_Institution
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
fYear
2011
fDate
18-21 July 2011
Firstpage
326
Lastpage
329
Abstract
3D stacking and integration can provide significant system advantages. Following a brief technology review, this abstract explores application drivers, design and CAD for 3D ICs. The main 3D exploitation explored in detail is that of logic on memory. This application is explored in a specific DSP example, showing a 25% power advantage when implemented in 3D compared with 2D. Finally critical areas that need better solutions are explored. These include cost management, design planning, test management, and thermal management.
Keywords
electronic design automation; three-dimensional integrated circuits; 3D IC; 3D specific systems design; 3D stacking; CAD; cost management; design planning; test management; thermal management; Bandwidth; Memory management; Silicon; Stacking; Thermal analysis; Three dimensional displays; Through-silicon vias; 3D IC; 3DIC; FFT; TSV; memory on logic; stacked memory; three dimensional IC;
fLanguage
English
Publisher
ieee
Conference_Titel
Embedded Computer Systems (SAMOS), 2011 International Conference on
Conference_Location
Samos
Print_ISBN
978-1-4577-0802-2
Electronic_ISBN
978-1-4577-0801-5
Type
conf
DOI
10.1109/SAMOS.2011.6045479
Filename
6045479
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