• DocumentCode
    1822534
  • Title

    Development of heat-resistant XLPE cable and accessories

  • Author

    Yamada, H. ; Nakagawa, S. ; Katakai, S. ; Kishi, K. ; Nakanishi, T. ; Murata, Y.

  • Author_Institution
    Kansai Electr. Power Co. Inc., Hyogo, Japan
  • Volume
    2
  • fYear
    2003
  • fDate
    1-5 June 2003
  • Firstpage
    776
  • Abstract
    We have developed heat-resistant XLPE cable and accessories that can be operated at 105°C as the maximum permissible conductor temperature in normal operation. Through this cable system, greater transmission capacity can be achieved using existing cable ducts and without increasing the conductor size of the cable. Also, the problem of hot spans through the cable route can be solved by replacing conventional XLPE cable with the newly developed heat-resistant XLPE cable. We have developed heat-resistant XLPE insulation material which bas a higher melting point than conventional XLPE. The heat deformation of the new material at 105°C is less than that of conventional XLPE at 90°C.The breakdown strength of heat-resistant XLPE cable at 105°C is almost the same as that of conventional XLPE cable at 90. Conventional self-pressurized rubber joints (hereafter SPJ) can be applied to heat-resistant cable lines with the new waterproof joint compound with low heat resistivity.
  • Keywords
    XLPE insulation; cable insulation; electric breakdown; melting point; organic insulating materials; 105 degC; breakdown strength; cable accessories; cable system; heat deformation; heat resistivity; heat-resistant XLPE cable; insulation material; melting point; permissible conductor temperature; transmission capacity; Cable insulation; Conducting materials; Curing; Dielectrics and electrical insulation; Electric variables; Mechanical cables; Resistance heating; Temperature dependence; Thermal degradation; Thermal expansion;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 2003. Proceedings of the 7th International Conference on
  • ISSN
    1081-7735
  • Print_ISBN
    0-7803-7725-7
  • Type

    conf

  • DOI
    10.1109/ICPADM.2003.1218533
  • Filename
    1218533