DocumentCode :
1822534
Title :
Development of heat-resistant XLPE cable and accessories
Author :
Yamada, H. ; Nakagawa, S. ; Katakai, S. ; Kishi, K. ; Nakanishi, T. ; Murata, Y.
Author_Institution :
Kansai Electr. Power Co. Inc., Hyogo, Japan
Volume :
2
fYear :
2003
fDate :
1-5 June 2003
Firstpage :
776
Abstract :
We have developed heat-resistant XLPE cable and accessories that can be operated at 105°C as the maximum permissible conductor temperature in normal operation. Through this cable system, greater transmission capacity can be achieved using existing cable ducts and without increasing the conductor size of the cable. Also, the problem of hot spans through the cable route can be solved by replacing conventional XLPE cable with the newly developed heat-resistant XLPE cable. We have developed heat-resistant XLPE insulation material which bas a higher melting point than conventional XLPE. The heat deformation of the new material at 105°C is less than that of conventional XLPE at 90°C.The breakdown strength of heat-resistant XLPE cable at 105°C is almost the same as that of conventional XLPE cable at 90. Conventional self-pressurized rubber joints (hereafter SPJ) can be applied to heat-resistant cable lines with the new waterproof joint compound with low heat resistivity.
Keywords :
XLPE insulation; cable insulation; electric breakdown; melting point; organic insulating materials; 105 degC; breakdown strength; cable accessories; cable system; heat deformation; heat resistivity; heat-resistant XLPE cable; insulation material; melting point; permissible conductor temperature; transmission capacity; Cable insulation; Conducting materials; Curing; Dielectrics and electrical insulation; Electric variables; Mechanical cables; Resistance heating; Temperature dependence; Thermal degradation; Thermal expansion;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Properties and Applications of Dielectric Materials, 2003. Proceedings of the 7th International Conference on
ISSN :
1081-7735
Print_ISBN :
0-7803-7725-7
Type :
conf
DOI :
10.1109/ICPADM.2003.1218533
Filename :
1218533
Link To Document :
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