DocumentCode
1822558
Title
System-level thermal design and testing of a 3G wireless network gateway
Author
Obinelo, Izuh
Author_Institution
Degree Controls Inc., Milford, NH
fYear
2006
fDate
14-16 March 2006
Firstpage
16
Lastpage
22
Abstract
A major OEM of dedicated gateways for mobile networks was faced with a show-stopping problem: their flagship product was failing during initial field tests due to overheating, so what to do to salvage their multi-million dollar investment and thousands of hours of development effort? The design of an improved thermal architecture for the product is the subject of this paper
Keywords
3G mobile communication; network servers; thermal management (packaging); 3G wireless network gateway; mobile networks; overheating problem; system-level thermal design; Communication equipment; Computational fluid dynamics; Electronic components; Electronic packaging thermal management; Investments; Packaging machines; Power system reliability; System testing; Thermal management; Wireless networks;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2006 IEEE Twenty-Second Annual IEEE
Conference_Location
Dallas, TX
Print_ISBN
1-4244-0153-4
Type
conf
DOI
10.1109/STHERM.2006.1625200
Filename
1625200
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