• DocumentCode
    1823114
  • Title

    Connectivity-based parcellation of the cortical surface using q-ball imaging

  • Author

    Guevara, Pamela ; Perrin, Muriel ; Cathier, Pascal ; Cointepas, Yann ; Riviere, Denis ; Poupon, Cyril ; Mangin, Jean Francois

  • Author_Institution
    CEA, Neurospin, Gif-sur-Yvette
  • fYear
    2008
  • fDate
    14-17 May 2008
  • Firstpage
    903
  • Lastpage
    906
  • Abstract
    This work exploits the idea that each individual brain region has a specific connection profile to create parcellations of the cortical surface using MR diffusion imaging. The parcellation is performed in two steps. First, for each vertex of a cortical surface mesh, a connection profile is computed using a probabilistic tractography framework. The tractography is performed from q-ball fields using regularized particle trajectories. The raw connectivity matrix is smoothed over the surface to account for a reasonable uncertainty on the tractography result. A cortical surface parcellation in 36 large gyri is used to reduce the connectivity profiles dimension. For each vertex, interconnection with the gyri is determined, leading to a connectivity profile made up of only 36 connection strengths. These profiles are clustered on a gyrus by gyrus basis using a k-means approach including spatial regularization. The reproducibility of the results is studied for three subjects.
  • Keywords
    biomedical MRI; brain; neural nets; MR diffusion imaging; Q-ball imaging; connectivity profile; connectivity-based parcellation; cortical surface mesh; individual brain region; k-means clustering; probabilistic tractography; regularized particle trajectory; Anisotropic magnetoresistance; Assembly; Cerebral cortex; Diffusion tensor imaging; Face; Humans; Joining processes; Magnetic resonance imaging; Medical services; Neurons; connectivity; diffusion; parcellation; q-ball imaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Biomedical Imaging: From Nano to Macro, 2008. ISBI 2008. 5th IEEE International Symposium on
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4244-2002-5
  • Electronic_ISBN
    978-1-4244-2003-2
  • Type

    conf

  • DOI
    10.1109/ISBI.2008.4541143
  • Filename
    4541143