Title :
High performance infiltrant-free cryogenic machining of 82% density porous tungsten under computer numerical control
Author :
Schoop, Julius ; Jawahir, I.S. ; Balk, T. John ; Busbaher, Daniel
Author_Institution :
Inst. for Sustainable Manuf., Univ. of Kentucky, Lexington, KY, USA
Abstract :
Cryogenic machining was used as a means to eliminate the conventional methyl-methacrylate infiltration process used in the manufacture of dispenser cathode matrices. The resulting surfaces were analyzed before and after impregnation to determine their suitability for dispenser cathodes.
Keywords :
cathodes; cryogenics; machining; tungsten; W; computer numerical control; density porous tungsten; dispenser cathode matrices; infiltrant-free cryogenic machining; methyl-methacrylate infiltration process; Cathodes; Machining; Rough surfaces; Surface morphology; Surface roughness; Surface topography; Tungsten; cryogenic machining; dispenser cathode; porous tungsten; surface integrity;
Conference_Titel :
Vacuum Electronics Conference, IEEE International
Conference_Location :
Monterey, CA
DOI :
10.1109/IVEC.2014.6857543
