Diamond pins utilized as thermal vias for high heat flux spreading in CTE-compatible lids and substrates for semiconductor packaging

Author

Saums, David L. ; Edward, Brian ; Ruzicka, Peter ; Fennessy, Kevin ; Hay, Robert ; Zimmer, Jerry ; Sundberg, Glenn J.

Author_Institution

DS & A LLC, Newburyport, MA

fYear

2006

fDate

14-16 March 2006

Firstpage

162

Lastpage

172

Abstract

CVD diamond segments inserted into an extremely high thermal conductivity graphite heat spreader within an expansion-matched composite structure are described as a semiconductor packaging material construction. These development materials are evaluated to address high heat flux spreading requirements of on-die hot spots and the need to match differing coefficients of thermal expansion with other packaging components and semiconductor die materials

Keywords

CVD coatings; diamond; semiconductor device packaging; silicon compounds; thermal expansion; wide band gap semiconductors; CTE-compatible lids; CVD diamond segments; IGBT; SiC; chemical vapor deposition; coefficient of thermal expansion; diamond pins; die hot spots; extremely high thermal conductivity; graphite heat spreader; high heat flux spreading; isolated gate bipolar transistor; metal matrix composite; semiconductor packaging; silicon carbide; substrates; thermal impedance; thermal resistance; thermal vias; wide bandgap semiconductor; Conducting materials; Electronic packaging thermal management; Pins; Semiconductor device packaging; Semiconductor materials; Substrates; Thermal conductivity; Thermal engineering; Thermal expansion; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 2006 IEEE Twenty-Second Annual IEEE

Conference_Location

Dallas, TX

Print_ISBN

1-4244-0153-4

Type

conf

DOI

10.1109/STHERM.2006.1625223

Filename

1625223