DocumentCode :
1823373
Title :
A thermoreflectance thermography system for measuring the transient surface temperature field of activated electronic devices
Author :
Komarov, Pavel L. ; Burzo, Mihai G. ; Raad, Peter E.
Author_Institution :
Dept. of Mech. Eng., Southern Methodist Univ., Dallas, TX
fYear :
2006
fDate :
14-16 March 2006
Firstpage :
199
Lastpage :
203
Abstract :
This work reports on a system that can determine the thermal behavior of an activated complex microelectronic device by measuring its surface temperature field with a thermoreflectance-based system. The article describes the features of the experimental setup, provides details of the calibration process used to map the changes in the measured surface reflectivity to absolute temperature values, and explains the data acquisition procedure used to measure the transient temperature over a given active region of interest. The method is applied to determine the thermal behavior of actual MOSFET devices. First, the method is used to measure an activated MOSFET device and show that by scanning first and then switching the source and drain contacts, the two resulting steady state temperature scans are symmetrical. The method is then used to differentiate between the transient thermal behavior of identically activated devices that have been made on two different epitaxial layers, one with natural silicon and the other with isotopically-pure silicon
Keywords :
MOSFET; infrared imaging; semiconductor device measurement; temperature measurement; thermal analysis; thermoreflectance; MOSFET devices; complex microelectronic device; epitaxial layers; surface reflectivity; surface temperature field measurement; thermal behavior; thermoreflectance thermography; Calibration; Data acquisition; Epitaxial layers; MOSFET circuits; Microelectronics; Reflectivity; Silicon; Steady-state; Temperature measurement; Thermoreflectance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2006 IEEE Twenty-Second Annual IEEE
Conference_Location :
Dallas, TX
Print_ISBN :
1-4244-0153-4
Type :
conf
DOI :
10.1109/STHERM.2006.1625228
Filename :
1625228
Link To Document :
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