Title :
Reliability of stack packaging varying the die stacking architectures for flash memory applications
Author :
Hossain, Mohammad M. ; Lee, Yongje ; Akhter, Roksana ; Agonafer, Dereje ; Pekin, Senol ; Dishongh, Terry
Author_Institution :
Texas Univ., Arlington, TX
Abstract :
Thermal analysis on various die stacking architectures, which are commonly employed in semiconductor flash products shows that thermal issues are not dominant for stack die configuration and leads to study the effect of combined thermo-mechanical and mechanical stresses. As there are existence of multiple die and other material with different CTEs, thermo-mechanical loading and its effect on reliability needs to be studied for optimum package design and die configuration
Keywords :
chip scale packaging; flash memories; mechanical stability; reliability; thermal analysis; thermomechanical treatment; 3D stack package; die stacking architecture; finite element modeling; flash memory; package design; thermo-mechanical reliability; Bonding; Chip scale packaging; Electronic packaging thermal management; Flash memory; Integrated circuit packaging; Memory architecture; Stacking; Thermal stresses; Thermomechanical processes; Wire;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2006 IEEE Twenty-Second Annual IEEE
Conference_Location :
Dallas, TX
Print_ISBN :
1-4244-0153-4
DOI :
10.1109/STHERM.2006.1625232
