Title :
Flow Simulation of a Diaphragm-type Ventricular Assist Device with Structural Interactions
Author :
Moosavi, M.H. ; Fatouraee, N.
Author_Institution :
Amirkabir Univ. of Technol., Tehran
Abstract :
A numerical simulation of the fluid and structure interactions was performed for a diaphragm-type ventricular assist device (VAD). The simulation was included two incompressible fluids and three elastic solid regions. The detailed information of both fluid and solid dynamic are crucial to evaluate the performance of the device. Localization of potential points prone to hemolysis and thrombus formation and disturbed flow with creation of recirculation zones are vary important. Here, the HeartSaver VAD was modeled as a two dimensional chambers with an inlet and an outlet elastic valves, an elastic sac-shape membrane, driving fluid and blood. A pulsatile velocity condition was applied at the inlet of the driving fluid chamber. As the results, the flow characteristics affecting the blood cells including velocity, pressure, wall shear stress and the elastic valves operation were presented in details.
Keywords :
blood; cardiology; cellular biophysics; flow simulation; haemodynamics; prosthetics; pulsatile flow; shear flow; HeartSaver ventricular assist device; blood cells; diaphragm-type ventricular assist device; disturbed flow; elastic sac-shape membrane; elastic solid regions; elastic valves operation; flow pressure; flow simulation; flow velocity; hemolysis; incompressible fluids; numerical simulation; pulsatile velocity condition; recirculation zones; thrombus formation; two dimensional chambers; wall shear stress; Blood; Cardiac disease; Fluid dynamics; Heart; Instruments; Pumps; Region 2; Solid modeling; Stress; Valves; Blood Flow Velocity; Blood Pressure; Computer Simulation; Computer-Aided Design; Equipment Design; Equipment Failure Analysis; Heart-Assist Devices; Models, Cardiovascular; Ventricular Function;
Conference_Titel :
Engineering in Medicine and Biology Society, 2007. EMBS 2007. 29th Annual International Conference of the IEEE
Conference_Location :
Lyon
Print_ISBN :
978-1-4244-0787-3
DOI :
10.1109/IEMBS.2007.4352469