Title :
The Circumferential Loading of a Direct Cardiac Compression Assist Device
Author :
Keeling, D.G. ; Levesley, M.C. ; Walker, P.G. ; Hanson, B.M. ; Watterson, K. ; Pereni, C.I. ; Jaber, O.
Author_Institution :
Univ. of Leeds, Leeds
Abstract :
Heart disease is the developed world´s largest killer. Transplantation of the failing heart remains the most effective treatment currently employed, but demand far exceeds donor supply. In a bid to address this imbalance, the use of mechanical circulatory support has been explored since the mid-1960s. This paper utilizes one such device, which achieves assistance by mechanically compressing the epicardial surface of the failing heart. The circumferential normal loading of the device is investigated, showing how frictional effects inherent to the device´s operation affect localized surface pressure. Results showed that as distance from the device´s actuator increased, assistive systolic force reduced, whilst device constriction to ventricular filling detrimentally increased. Active device relaxation was shown to limit the diastolic effect outlined above, providing the simulated diseased heart with an improved cardiac output. The results also raise questions concerning device in-vivo positioning and short-comings with the current heart simulator.
Keywords :
cardiology; friction; orthotics; prosthetics; active device relaxation; assistive systolic force; cardiac compression assist device; circumferential normal loading; diastolic effect; epicardial surface; frictional effects; heart disease; mechanical circulatory support; Actuators; Cardiac disease; Cardiovascular diseases; Computational modeling; Filling; Heart; In vitro; Muscles; Supply and demand; Surface treatment; Blood Flow Velocity; Blood Pressure; Compressive Strength; Computer Simulation; Computer-Aided Design; Equipment Design; Equipment Failure Analysis; Friction; Heart; Heart-Assist Devices; Models, Cardiovascular;
Conference_Titel :
Engineering in Medicine and Biology Society, 2007. EMBS 2007. 29th Annual International Conference of the IEEE
Conference_Location :
Lyon
Print_ISBN :
978-1-4244-0787-3
DOI :
10.1109/IEMBS.2007.4352470