DocumentCode
1824243
Title
A contribution to the evaluation of HMM for IO design
Author
Song, M.H. ; Smedes, T. ; Tseng, J.C. ; Chang, T.H. ; Derikx, R. ; Velghe, R.
Author_Institution
TSMC, Hsinchu, Taiwan
fYear
2011
fDate
11-16 Sept. 2011
Firstpage
1
Lastpage
7
Abstract
An ESD gun measurement setup, including PCB/socket design and package selection, is presented. Measurements with this setup show a stable correlation with on-wafer HMM testing results. Also correlation factors with HBM and TLP are presented Case studies demonstrate that small details may have a significant effect on the results.
Keywords
electric connectors; electronics packaging; electrostatic devices; electrostatic discharge; printed circuit design; ESD gun measurement setup; HBM correlation factors; HMM evaluation; IO design; PCB-socket design; TLP correlation factors; human metal model; on-wafer HMM testing; package selection; Correlation; Electrostatic discharge; Hidden Markov models; Impedance; Monitoring; Stress; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2011 33rd
Conference_Location
Anaheim, CA
ISSN
Pending
Electronic_ISBN
Pending
Type
conf
Filename
6045599
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