DocumentCode
1824371
Title
Photonic integration on InP for telecom and datacom applications
Author
Kaiser, Ronald
Author_Institution
Heinrich-Hertz-Inst., Fraunhofer Inst. for Telecommun., Berlin, Germany
Volume
2
fYear
2005
fDate
6-11 March 2005
Abstract
The current and future role of photonic InP integration in order to provide suitable single chip components for telecom and datacom markets is emphasized under the requirement of existing alternative and complementary technologies.
Keywords
III-V semiconductors; data communication; indium compounds; integrated optics; integrated optoelectronics; datacom applications; photonic integration; single chip components; telecom applications; Costs; High speed optical techniques; Indium phosphide; Integrated optics; Optical crosstalk; Optical fiber communication; Optical receivers; Optical transmitters; Repeaters; Telecommunications;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical Fiber Communication Conference, 2005. Technical Digest. OFC/NFOEC
Print_ISBN
1-55752-783-0
Type
conf
DOI
10.1109/OFC.2005.192659
Filename
1498395
Link To Document