Title :
Photonic integration on InP for telecom and datacom applications
Author_Institution :
Heinrich-Hertz-Inst., Fraunhofer Inst. for Telecommun., Berlin, Germany
Abstract :
The current and future role of photonic InP integration in order to provide suitable single chip components for telecom and datacom markets is emphasized under the requirement of existing alternative and complementary technologies.
Keywords :
III-V semiconductors; data communication; indium compounds; integrated optics; integrated optoelectronics; datacom applications; photonic integration; single chip components; telecom applications; Costs; High speed optical techniques; Indium phosphide; Integrated optics; Optical crosstalk; Optical fiber communication; Optical receivers; Optical transmitters; Repeaters; Telecommunications;
Conference_Titel :
Optical Fiber Communication Conference, 2005. Technical Digest. OFC/NFOEC
Print_ISBN :
1-55752-783-0
DOI :
10.1109/OFC.2005.192659
