Title :
Dielectric characterization of polycrystalline and epitaxial thin-film CaCu3Ti4O12 (CCTO)
Author :
Li, Jianren ; Cho, Kyuho ; Wu, Naijuan ; Ignatiev, Alex
Author_Institution :
Coll. of Technol., Houston Univ., USA
Abstract :
High dielectric CaCu3Ti4O12 (CCTO) thin films were successfully grown on SrRuO3 (SRO) conductive films on LaAlO3 (LAO) substrates by the Pulsed Laser Deposition (PLD) method. Both the Dielectric properties of the [001] oriented epitaxial thin-film and the polycrystalline CCTO were evaluated. The general feature of the dielectric responses of the [001] epitaxial thin film and the polycrystalline CCTO are similar. That is, both can be modeled by the series combination of two parallel R-C circuits. While the gigantic relaxation process observed in polycrystalline CCTO is accounted for by the interaction between the grain volume resistance and grain boundary capacitance, the gigantic relaxation process in the [001] oriented epitaxial thin-film CCTO is proposed to be caused by the mutual interaction of the domain volume resistance and the domain boundary capacitance. Domain boundaries are likely to be at twin boundaries within the [001] oriented epitaxial thin-film CCTO.
Keywords :
calcium compounds; copper compounds; dielectric materials; dielectric relaxation; dielectric thin films; domain boundaries; epitaxial layers; permittivity; pulsed laser deposition; twin boundaries; CaCu3Ti4O12; LaAlO3 substrates; SrRuO3 conductive films; SrRuO3-LaAlO3; [001] oriented epitaxial thin-films; dielectric properties; dielectric thin films; domain boundary capacitance; domain volume resistance; gigantic relaxation process; grain boundary capacitance; grain volume resistance; parallel R-C circuits; polycrystalline thin films; pulsed laser deposition; twin boundaries; Capacitance; Conductive films; Dielectric substrates; Dielectric thin films; Laser modes; Optical pulses; Pulsed laser deposition; Sputtering; Thin film circuits; Volume relaxation;
Conference_Titel :
Properties and Applications of Dielectric Materials, 2003. Proceedings of the 7th International Conference on
Print_ISBN :
0-7803-7725-7
DOI :
10.1109/ICPADM.2003.1218614