Title :
Study of system ESD codesign of a realistic mobile board
Author :
Johnsson, David ; Gossner, Harald
Author_Institution :
Intel Mobile Commun. GmbH, Neubiberg, Germany
Abstract :
Based on a mobile reference board a full system ESD IC/board codesign flow was examined. Accurate high current transient models of the components and extracted board parasitics were used to simulate the effect of voltage overshoots during the first peak of the IEC 61000-4-2 pulse.
Keywords :
IEC standards; electrostatic discharge; integrated circuit design; printed circuit design; transient analysis; IEC 61000-4-2 pulse; PCB design; board codesign flow; full system ESD IC codesign; high current transient models; realistic mobile board; Current measurement; Electrostatic discharge; Integrated circuit modeling; Mobile communication; Robustness; Voltage measurement;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2011 33rd
Conference_Location :
Anaheim, CA
Electronic_ISBN :
Pending
