DocumentCode :
1824977
Title :
Evaluation of polyimide as substrate material for electrodes to interface the peripheral nervous system
Author :
Stieglitz, T. ; Schuettler, M. ; Rubehn, B. ; Boretius, T. ; Badia, J. ; Navarro, X.
Author_Institution :
Dept. of Microsyst. Eng., Univ. of Freiburg, Freiburg, Germany
fYear :
2011
fDate :
April 27 2011-May 1 2011
Firstpage :
529
Lastpage :
533
Abstract :
The introduction of micromachining technologies into design and development of interfaces to the peripheral nervous systems more than 20 years ago led to novel silicon and polymer based microimplants. Polyimide has been chosen as candidate for flexible implants. In this work, the investigations on different designs, the material stability and different aspects of biocompatibility as well as the functional outcome of different electrode designs will be presented. Sieve electrodes to interface regenerating nerves, multichannel cuff electrodes but also newer concepts like longitudinal and transverse intrafascicular multichannel electrodes (LIFE, TIME) have been developed with polyimide as substrate and insulation material. Evaluation in vitro as well as in vivo of the material itself but also of the different electrode designs and concepts showed good material stability, no material toxicity, only little foreign body reaction after implantation and good spatial selectivity of the electrodes depending on the chosen concept to interface the peripheral nerve.
Keywords :
biomedical electrodes; biomedical materials; microelectrodes; micromachining; neurophysiology; polymers; prosthetics; toxicology; biocompatibility; electrodes; flexible implants; implantation; interface regenerating nerves; longitudinal intrafascicular multichannel electrodes; material stability; microimplants; micromachining technologies; multichannel cuff electrodes; peripheral nervous system; polyimide; sieve electrodes; spatial selectivity; toxicity; transverse intrafascicular multichannel electrodes; Coatings; Electrodes; Implants; Platinum; Polyimides; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Neural Engineering (NER), 2011 5th International IEEE/EMBS Conference on
Conference_Location :
Cancun
ISSN :
1948-3546
Print_ISBN :
978-1-4244-4140-2
Type :
conf
DOI :
10.1109/NER.2011.5910602
Filename :
5910602
Link To Document :
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