Title :
The bandwidth benefits of close-to-chip lumped element matching of microwave high power amplifiers
Author :
Wong, J N H ; Aitchison, C.S.
Author_Institution :
Sch. of Electron. Eng., Inf. Technol. & Math., Surrey Univ., Guildford, UK
Abstract :
The bandwidth benefits of Close-to-Chip matching using lumped elements within the transistor encapsulation compared with Off-Chip matching using distributed elements outside the transistor encapsulation for high power microwave transistors have been simulated at 2 GHz. Simulation results indicate that Close-to-Chip matching using lumped elements gives a wider bandwidth compared with conventional Off-Chip matching using distributed elements
Keywords :
impedance matching; lumped parameter networks; microwave power amplifiers; microwave power transistors; 2 GHz; bandwidth; close-to-chip lumped element matching; microwave high power amplifier; off-chip distributed element matching; transistor encapsulation; Bandwidth; Distributed amplifiers; Encapsulation; Equivalent circuits; High power amplifiers; Information technology; Mathematics; Microwave transistors; Power engineering and energy; Reflection;
Conference_Titel :
High Frequency Postgraduate Student Colloquium, 2001. 6th IEEE
Conference_Location :
Cardiff
Print_ISBN :
0-7803-7118-6
DOI :
10.1109/HFPSC.2001.962186
