• DocumentCode
    1825302
  • Title

    Identification of skin lesions from the transient thermal response using infrared imaging technique

  • Author

    Cetingul, Pirtini M. ; Herman

  • Author_Institution
    Dept. of Mech. Eng., Johns Hopkins Univ., Baltimore, MD
  • fYear
    2008
  • fDate
    14-17 May 2008
  • Firstpage
    1219
  • Lastpage
    1222
  • Abstract
    Increased availability of thermal imaging cameras has led to an interest in the application of infrared imaging techniques to the detection and identification of subsurface structures. We study the use of the transient thermal response of skin layers to determine to which extent surface temperature distribution reflects the properties of subsurface structures, such as lesions. A numerical model using the finite element method is described to obtain this response, which enables us to draw conclusions regarding the size, depth and nature of subsurface structures. This work validates the idea of examining the transient thermal response and using thermal imaging as a solution for lesion identification. A sensitivity study of surface temperature distribution to variations of thermophysical properties, blood perfusion rate, and thicknesses of skin layers is performed. It is observed that variations in these parameters have minimal effects on surface temperature distribution.
  • Keywords
    biomedical optical imaging; biothermics; blood; finite element analysis; haemorheology; infrared imaging; physiological models; skin; blood perfusion rate; finite element method; infrared imaging technique; skin layer thickness; skin lesion identification; subsurface structures; surface temperature distribution; transient thermal response; Blood; Cameras; Finite element methods; Infrared detectors; Infrared imaging; Lesions; Numerical models; Optical imaging; Skin; Temperature distribution; Infrared imaging; Skin lesions; Transient thermal response;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Biomedical Imaging: From Nano to Macro, 2008. ISBI 2008. 5th IEEE International Symposium on
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4244-2002-5
  • Electronic_ISBN
    978-1-4244-2003-2
  • Type

    conf

  • DOI
    10.1109/ISBI.2008.4541222
  • Filename
    4541222