• DocumentCode
    1825308
  • Title

    A serial scan test vector compression methodology

  • Author

    Su, Chauchin ; Hwang, Kychin

  • Author_Institution
    Dept. of Electr. Eng., Nat. Central Univ., Chung-Li, Taiwan
  • fYear
    1993
  • fDate
    17-21 Oct 1993
  • Firstpage
    981
  • Lastpage
    988
  • Abstract
    This paper presents a serial scan test vector compression methodology for the test time reduction in a scan-based test environment. The reduction is achieved by the overlapping of two consecutive vectors. Hence, the order of test vectors determines the amount of reduction in tiem. Here, two test vector ordering algorithms, depth first greedy and coalesced simple orders algorithms, have been derived, implemented, and tested. Experimental results obtained are very close to estimations by statistical analysis
  • Keywords
    VLSI; boundary scan testing; computational complexity; fault diagnosis; integrated circuit testing; logic testing; statistical analysis; VLSI; iterative methods; overlapping; serial scan test vector compression; statistical analysis; test time reduction; test vector ordering algorithms; Circuit faults; Circuit testing; Compaction; Costs; Design for testability; Digital circuits; Research and development; Sequential analysis; Statistical analysis; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1993. Proceedings., International
  • Conference_Location
    Baltimore, MD
  • Print_ISBN
    0-7803-1430-1
  • Type

    conf

  • DOI
    10.1109/TEST.1993.470601
  • Filename
    470601