Title :
A potential failure reason for Spindt cathodes in high current applications
Author :
Xinghui Li ; Guodong Bai ; Hanyan Li ; Mingqing Ding ; Jinjun Feng ; Fujiang Liao
Author_Institution :
Nat. Key Lab. of Sci. & Technol. on Vacuum Electron., Beijing Vacuum Electron. Res. Inst., Beijing, China
Abstract :
We believe one main reason for Spindt cathodes failure in initial testing is metal particle adhesion produced in cone formation process. It is also a potential failure reason in high current applications. Preliminary experiments show megahertz ultrasonic cleaning is effective in removing the particles but further work is still need.
Keywords :
adhesion; failure analysis; flashover; ultrasonic cleaning; Spindt cathodes failure; cone formation process; high current applications; megahertz ultrasonic cleaning; metal particle adhesion; Acoustics; Adhesives; Cathodes; Cavity resonators; Cleaning; Logic gates; Metals; Spindt cathode; cathode failure; high current application; megahertz ultrasonic cleaning; metal particle adhesion;
Conference_Titel :
Vacuum Electronics Conference, IEEE International
Conference_Location :
Monterey, CA
DOI :
10.1109/IVEC.2014.6857713
