Title :
Integration and packaging of devices for 100-Gb/s transmission
Author :
Sinsky, Jeffrey H.
Author_Institution :
Bell Labs., Alcatel-Lucent, Holmdel, NJ
Abstract :
Designing high-speed opto-electronic components necessary for 100-Gb/s transmission systems is a challenging undertaking. Methodologies and techniques for designing such components will be discussed, and the advantages of hybrid opto-electronic integration will be explained and demonstrated.
Keywords :
integrated optoelectronics; packaging; opto-electronic components; opto-electronic integration; packaging; transmission systems; Bandwidth; Distributed parameter circuits; High speed optical techniques; Integrated circuit interconnections; Microwave circuits; Optical devices; Packaging; Planar transmission lines; Scattering parameters; Transmission line theory; (250.0040) Detectors; (250.3140) Integrated optoelectronic circuits;
Conference_Titel :
Optical Fiber Communication - incudes post deadline papers, 2009. OFC 2009. Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-2606-5
Electronic_ISBN :
978-1-55752-865-0
