Bondability of copper wires on PPF leadframe

Author

Wei, Tok Chee ; Ha, Johnny Yeung Ping

Author_Institution

Heraeus Mater. Singapore Pte Ltd., Singapore, Singapore

fYear

2011

fDate

7-9 Dec. 2011

Firstpage

12

Lastpage

19

Abstract

The imposition of lead-free production for most of electrical and electronic components in the 2006 EU legislation has lead to leadframes manufacturers looking into other solderable alternatives for PCB soldering assembly. One of the alternatives is Tin (Sn) plating but it brings along other risks such as whisker growth. Nickel palladium (NiPd) based PPF (Pre-Plated Finishes) leadframe becomes another feasible option with no Sn-whisker risk. This introduction has greatly economized the cost of IC assembly by eliminating the post-mold plating process.

Keywords

bonding processes; copper; electroplating; moulding; soldering; wires; 2006 EU legislation; IC assembly; PCB soldering assembly; PPF leadframe; bondability; copper wires; electrical components; electronic components; lead-free production; leadframe manufacturers; nickel palladium; post-mold plating process; pre-plated finishes leadframe; whisker growth; Bonding; Copper; Electronics packaging; High temperature superconductors; Lead; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th

Conference_Location

Singapore

Print_ISBN

978-1-4577-1983-7

Electronic_ISBN

978-1-4577-1981-3

Type

conf

DOI

10.1109/EPTC.2011.6184377

Filename

6184377