Interfacial microstructure and mechanical reliability of Cu pillar/Sn-3.5Ag bump for 3D packages

Author

Kwak, Byung-Hyun ; Jae-Myeong Kim ; Jeong, Myeong-Hyeok ; Lee, Kiwook ; Kim, Jaedong ; Park, Young-Bae

Author_Institution

Andong Nat. Univ., Andong, South Korea

fYear

2011

fDate

7-9 Dec. 2011

Firstpage

49

Lastpage

52

Abstract

Interfacial microstructure and mechanical reliability of Cu pillar/Sn-3.5Ag microbumps during annealing conditions were systematically and quantitatively evaluated. The IMC growth followed a linear relationship with the square root of the annealing time, which means that the IMC growth was controlled by a diffusion mechanism. The shear strength and IMC thickness increased quadratically with annealing time at 150°C, while the amount of solder decreased. It was clearly revealed that there exist strong correlations among IMC growth kinetics, shear strength, and fracture modes in Cu/solder microbumps.

Keywords

annealing; packaging; reliability; 3D package; IMC growth kinetics; IMC thickness; annealing conditions; annealing time; diffusion mechanism; fracture modes; interfacial microstructure; linear relationship; mechanical reliability; microbumps; shear strength; solder; square root; Annealing; Bonding; Copper; Joints; Microstructure; Reliability; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th

Conference_Location

Singapore

Print_ISBN

978-1-4577-1983-7

Electronic_ISBN

978-1-4577-1981-3

Type

conf

DOI

10.1109/EPTC.2011.6184384

Filename

6184384