Title :
Design and fabrication of a novel monolithic integration structure for un-cooled infrared focal plane array and readout IC
Author :
Ma, Shenglin ; Sun, Xin ; Zhu, Yunhui ; Cui, Qinghu ; Jin, Yufeng ; Yu, Xiaomei ; Chen, Jing ; Miao, Min
Author_Institution :
Nat. Key Lab. on Micro/Nano Fabrication Technol., Peking Univ., Beijing, China
Abstract :
In this paper, a monolithic integration structure with TSV interconnections is introduced for un-cooled infrared FPA to do easy wafer-level-package. Firstly, the challenging process for making the structure will be reviewed and identified. And then process sequence for making the TSV interconnections and RDLs and CMOS compatible surface process for IR FPA will be developed. In the end, a WLP scheme will be developed to show the benefit of easy WLP.
Keywords :
CMOS integrated circuits; focal planes; readout electronics; three-dimensional integrated circuits; wafer-scale integration; CMOS compatible surface process; RDL; TSV interconnections; WLP scheme; monolithic integration structure fabrication; readout IC; uncooled infrared FPA; uncooled infrared focal plane array; wafer-level-package; Copper; Etching; Fabrication; Monolithic integrated circuits; Through-silicon vias;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1983-7
Electronic_ISBN :
978-1-4577-1981-3
DOI :
10.1109/EPTC.2011.6184394
