Design and fabrication of a novel monolithic integration structure for un-cooled infrared focal plane array and readout IC

Author

Ma, Shenglin ; Sun, Xin ; Zhu, Yunhui ; Cui, Qinghu ; Jin, Yufeng ; Yu, Xiaomei ; Chen, Jing ; Miao, Min

Author_Institution

Nat. Key Lab. on Micro/Nano Fabrication Technol., Peking Univ., Beijing, China

fYear

2011

fDate

7-9 Dec. 2011

Firstpage

99

Lastpage

103

Abstract

In this paper, a monolithic integration structure with TSV interconnections is introduced for un-cooled infrared FPA to do easy wafer-level-package. Firstly, the challenging process for making the structure will be reviewed and identified. And then process sequence for making the TSV interconnections and RDLs and CMOS compatible surface process for IR FPA will be developed. In the end, a WLP scheme will be developed to show the benefit of easy WLP.

Keywords

CMOS integrated circuits; focal planes; readout electronics; three-dimensional integrated circuits; wafer-scale integration; CMOS compatible surface process; RDL; TSV interconnections; WLP scheme; monolithic integration structure fabrication; readout IC; uncooled infrared FPA; uncooled infrared focal plane array; wafer-level-package; Copper; Etching; Fabrication; Monolithic integrated circuits; Through-silicon vias;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th

Conference_Location

Singapore

Print_ISBN

978-1-4577-1983-7

Electronic_ISBN

978-1-4577-1981-3

Type

conf

DOI

10.1109/EPTC.2011.6184394

Filename

6184394