A introduction of sFCCSP - fine pitch low profile FCCSP solution

As for mainstream portable application (Mobile Phone, Tablet, Handset Gamer), the higher density (array IO pitch ⇐ 100um), higher thermal performance (better theta JC than over-mold FCCSP) and lower profile (compare with over-mold FCCSP) is necessary for package developing. At present, followed the Moor´s law, the bump pitch of 28nm wafer technology has shrunk from 180~150um into 130~100um or even finer. Based on above considerations and product characteristic request, some suitable solution can be considered: Utilize Cu Pillar Bump to satisfy the fine pitch request and also implement Die Exposed for current FCCSP to achieve the lower profile & better thermal performance. As to come out an easy way to recognize the package type of this combination, the package type of “sFCCSP” (SPIL proposed FCCSP-Exposed Die Cu Pillar FCCSP) had be called for further discussion.