Integrating electrical test into final assembly

This paper describes a set of projects that combine integrated circuit assembly steps. The completed set of projects will allow direct shipment of devices to customers from the end of the trim and form press. The integrated process steps include strip inspection, device mark, mark inspection, dambar removal, lead trim, final test, device form, device singulation, coplanarity inspection, reject sort and final package. The core change in assembly philosophy is to eliminate final test as a separate process step by performing the final test function earlier in the product flow