Catch the ground bounce before it hits your system

Author

Kurzweil, E. ; Lallement, M. ; Blanc, R. ; Pasquinelli, R.

Author_Institution

BULL, Massy, France

fYear

1993

fDate

17-21 Oct 1993

Firstpage

574

Lastpage

584

Abstract

The lack of an industry standard ground bounce characterization procedure led us to a definition of a new BULL specification of this parameter for various families of fast IC components. We have developed a corresponding characterization test. This paper describes our automatic characterization procedure of ground bounce (GB) using automatic test equipment. Three-dimensional Shmoo Plots and corresponding 3-D graphs are used for GB representation. Bench measurements are used to correlate the ATE results and to confirm the worst cases. A comparative study of various families of fast logic and PLD components demonstrates that the ground bounce is still a serious problem of fast IC devices

Keywords

automatic test equipment; automatic testing; integrated circuit noise; integrated circuit testing; logic testing; programmable logic devices; 3D Shmoo plots; 3D graphs; BULL specification; automatic test equipment; bench measurement; fast IC components; ground bounce; noise; Artificial intelligence; Automatic test equipment; Circuits; Differential equations; High-speed electronics; Inductance; Logic devices; Packaging; Testing; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference, 1993. Proceedings., International

Conference_Location

Baltimore, MD

Print_ISBN

0-7803-1430-1

Type

conf

DOI

10.1109/TEST.1993.470652

Filename

470652