Title :
Catch the ground bounce before it hits your system
Author :
Kurzweil, E. ; Lallement, M. ; Blanc, R. ; Pasquinelli, R.
Author_Institution :
BULL, Massy, France
Abstract :
The lack of an industry standard ground bounce characterization procedure led us to a definition of a new BULL specification of this parameter for various families of fast IC components. We have developed a corresponding characterization test. This paper describes our automatic characterization procedure of ground bounce (GB) using automatic test equipment. Three-dimensional Shmoo Plots and corresponding 3-D graphs are used for GB representation. Bench measurements are used to correlate the ATE results and to confirm the worst cases. A comparative study of various families of fast logic and PLD components demonstrates that the ground bounce is still a serious problem of fast IC devices
Keywords :
automatic test equipment; automatic testing; integrated circuit noise; integrated circuit testing; logic testing; programmable logic devices; 3D Shmoo plots; 3D graphs; BULL specification; automatic test equipment; bench measurement; fast IC components; ground bounce; noise; Artificial intelligence; Automatic test equipment; Circuits; Differential equations; High-speed electronics; Inductance; Logic devices; Packaging; Testing; Voltage;
Conference_Titel :
Test Conference, 1993. Proceedings., International
Conference_Location :
Baltimore, MD
Print_ISBN :
0-7803-1430-1
DOI :
10.1109/TEST.1993.470652
