• DocumentCode
    1826628
  • Title

    Hybrid EM/circuit modeling for carbon nanotubes based interconnects

  • Author

    Brun, Christophe ; Franck, Pierre ; Chong, Yap Chin ; Tan, Dunlin ; Tong, Edwin Teo Hang ; Bila, Stéphane ; Baillargeat, Dominique ; Tay, Beng Kang

  • Author_Institution
    XLIM, Univ. de Limoges, Limoges, France
  • fYear
    2011
  • fDate
    7-9 Dec. 2011
  • Firstpage
    158
  • Lastpage
    162
  • Abstract
    In this paper, carbon nanotube models for high-frequency interconnect applications are studied applying electromagnetic and circuit approaches. A first validation of both models gives a better understanding of carbon nanotubes behaviors in RF. The complex surface impedance used in this paper is derived from Hanson´s conductivity in order to take in consideration the quantum capacitance and all other components existing in nano-scale world. A study of CNT inter-coupling is then possible within a transmission line configuration above a ground plane. In future devices, nano-interconnect based on CNTs will be gathered within bundles, a better comprehension of coupling inside and around this bundle allows developing complex CNT bundle models. A RF device approach using CNT bundle models is brought at the end of this paper.
  • Keywords
    carbon nanotubes; integrated circuit interconnections; integrated circuit modelling; transmission lines; CNT intercoupling; Hanson conductivity; carbon nanotube; circuit approach; complex surface impedance; coupling comprehension; electromagnetic approach; ground plane; high-frequency interconnect application; hybrid EM-circuit modeling; nanointerconnect; quantum capacitance; transmission line configuration; Capacitance; Carbon nanotubes; Couplings; Electromagnetics; Integrated circuit interconnections; Integrated circuit modeling; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4577-1983-7
  • Electronic_ISBN
    978-1-4577-1981-3
  • Type

    conf

  • DOI
    10.1109/EPTC.2011.6184406
  • Filename
    6184406