Title :
Characterization of CNT interconnection bumps implemented for 1st level flip chip packaging
Author :
Yap, Chin Chong ; Tan, Dunlin ; Brun, Christophe ; Teo, Edwin Hang Tong ; Wei, Jun ; Dominique, Baillargeat ; Tay, Beng Kang
Author_Institution :
CINTRA, UMI, Singapore, Singapore
Abstract :
The fabrication procedures to contact the carbon nanotubes (CNT) to metal surface determine the contact resistance of the CNT bump. The large contact resistance is seen as a limiting factor to realize practical application using CNT bumps. An alternative bonding solution using CNT in physical contact with CNT using CNT interconnection bump is proposed. A study was conducted to determine the relationship between the bonding loads and bump resistances. It was concluded that the bump resistance decreases exponentially with the bonding load due to the change in inter-tube spacing. The lowest achieved CNT interconnection bump resistivity value was 0.05 Ω.cm.
Keywords :
bonding processes; carbon nanotubes; contact resistance; flip-chip devices; interconnections; C; CNT interconnection bump characterization; bonding loads; bump resistances; carbon nanotubes; contact resistance; first level flip chip packaging; inter-tube spacing; limiting factor; metal surface; Bonding; Carbon nanotubes; Electrical resistance measurement; Flip chip; Resistance; Semiconductor device measurement; Substrates;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1983-7
Electronic_ISBN :
978-1-4577-1981-3
DOI :
10.1109/EPTC.2011.6184414
