Development of high resolution imaging modules for wireless endoscopic applications

With advent of Capsule endoscopy (CE), GI tract lesion detection has become much easier for doctors and has lesson the burden on the Gastroscopy and colonoscopy procedures. Capsule endoscopy with its wireless features is leading the way in future diagnostic endoscopy. This work will present a high resolution imaging module and its integration with the wireless module for a full wireless capsule endoscopic application. The image sensor has a pixel resolution of 2.8 um and can operate up to 30 frames per second at 24 MHz clock. Various sub-blocks of imaging module, wireless ASIC+MCU chip module, ANT module, Power management module were integrated with FR4 substrate design. Various design for testing (DFT) features has being done in FR4 substrate and fabricated. Detailed assembly flow was created to assembly all the modules. Assembled module was packaged inside a capsule and ex-vivo animal trials were conducted. The results were encouraging with higher resolution images of GI tracks.