Title :
MEMS Tri-axial Tactile Sensor packaging using polymer fleible cable for sensorised guide wire application
Author :
Hamidullah, Muhammad ; Cheng, Ming-Yuan ; Lim, Li Shiah ; He, Cairan ; Feng, Hanhua ; Park, Woo Tae
Author_Institution :
Inst. of Micoelectronics, A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
Abstract :
This paper presents the integration process of tactile sensor system using polymer flexible cable for sensorised guide wire application and described the fabrication process flow of polyimide flexible cable, silicon holder and sensorised guide wire assembly processes. Polyimide flexible cable is used for the integration due its biocompatibility and suitable mechanical properties for flexible cable bending. Sensorised guide wire prototype was assembled using dummy sensor and ASIC chip.
Keywords :
electronics packaging; micromechanical devices; polymers; tactile sensors; ASIC chip; MEMS triaxial tactile sensor packaging; biocompatibility; fabrication process flow; flexible cable bending; polyimide flexible cable; polymer flexible cable; sensorised guide wire assembly process; silicon holder; Application specific integrated circuits; Assembly; Fixtures; Micromechanical devices; Polyimides; Silicon; Wires;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1983-7
Electronic_ISBN :
978-1-4577-1981-3
DOI :
10.1109/EPTC.2011.6184417
