Design of LED packaging module for automotive forward-lighting application

In this study, we firstly analyse the requirements both in optical and thermal fields in theory. With the results of theoretical analysis, we design the application specific light emitting diode (LED) packaging (ASLP) with optimized structure parameters and appropriate packaging materials. According to this design, several samples are made and tested. The test results show that the LED packaging can provide a light flux of 1000lm with a sharp cut-off and the chromaticity of packaging can comply with ECE regulations. Also, the thermal resistance of packaging can be less than 1.3K/W when equivalent heat transfer coefficient of cooling system is about 5000 W/(m²·K). Secondly, based on the test results, we design a supporting optical system with a novel freeform multi-reflector, an effective cooling system and even a complete LED packaging module for automotive forward-lighting application, including low-beam and high-beam functions. Finally, we test the performances of the LED packaging module, and the test results in simulation can fully comply with ECE and GB regulations.