DocumentCode
1826999
Title
Extraction of coupled SPICE models for packages and interconnects
Author
Diamond, Scott ; Janko, Bo
Author_Institution
Tektronix Inc., Beaverton, OR, USA
fYear
1993
fDate
17-21 Oct 1993
Firstpage
436
Lastpage
445
Abstract
We have developed a method, using TDR, to extract an equivalent coupled SPICE model for a set of package pins. The technique does not use any fitting or optimization. With the appropriate fixturing this method could be used for automated model extraction. The SPICE model which is produced, models the propagation delay and crosstalk between pins
Keywords
SPICE; crosstalk; delays; fault diagnosis; fault location; integrated circuit interconnections; integrated circuit modelling; integrated circuit testing; packaging; automated model extraction; coupled SPICE models; crosstalk; interconnects; leadless chip carrier; package pins; packages; Fixtures; Inductance; Inductors; Integrated circuit interconnections; Integrated circuit packaging; Pins; SPICE; Semiconductor device packaging; Testing; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1993. Proceedings., International
Conference_Location
Baltimore, MD
Print_ISBN
0-7803-1430-1
Type
conf
DOI
10.1109/TEST.1993.470668
Filename
470668
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